BAS116V
Document number: DS30562 Rev. 5 - 2
1 of 3
www.diodes.com
March 2008
? Diodes Incorporated
BAS116V
SURFACE MOUNT LOW LEAKAGE DIODE
Features
?
Surface Mount Package Ideally Suited for Automated Insertion
?
Very Low Leakage Current
?
Lead Free By Design/RoHS Compliant (Note 1)
?
"Green" Device (Note 4 and 5)
Mechanical Data
?
Case: SOT-563
?
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
?
Moisture Sensitivity: Level 1 per J-STD-020D
?
Terminal Connections: See Diagram
?
Terminals: Finish ?
Matte Tin annealed over Alloy 42
leadframe. Solderable per MIL-STD-202, Method 208
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Marking Information: See Page 2
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Ordering Information: See Page 2
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Weight: 0.003 grams (approximate)
TOP VIEW
BOTTOM VIEW
SOT-563
TOP VIEW
Internal Schematic
C1
A1
NC
NC
A2
C2
Maximum Ratings
@TA
= 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
85
V
RMS Reverse Voltage
VR(RMS)
60
V
Forward Continuous Current (Note 2)
IFM
215
mA
Repetitive Peak Forward Current
IFRM
500
mA
Non-Repetitive Peak Forward Surge Current @ t = 1.0μs
@ t = 1.0ms
@ t = 1.0s
IFSM
4.0
1.0
0.5
A
Thermal Characteristics
Characteristic
Symbol
Value
Unit
Power Dissipation (Note 2)
PD
150
mW
Thermal Resistance Junction to Ambient Air (Note 2)
RθJA
833
°C/W
Operating and Storage Temperature Range
TJ, TSTG
-65 to +150
°C
Electrical Characteristics
@TA
= 25°C unless otherwise specified
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
Reverse Breakdown Voltage (Note 3)
V(BR)R
85
?
?
V
IR
= 100
μA
Forward Voltage
VFM
?
?
0.90
1.0
1.1
1.25
V
IF
= 1.0mA
IF
= 10mA
IF
= 50mA
IF
= 150mA
Leakage Current (Note 3)
IRM
?
?
5.0
80
nA
nA
VR
= 75V
VR
= 75V, T
J
= 150
°C
Total Capacitance
CT
?
2
?
pF
VR
= 0, f = 1.0MHz
Reverse Recovery Time
trr
?
?
3.0
μs
IF
= I
R
= 10mA,
Irr = 0.1 x IR, RL
= 100
Ω
Notes: 1. No purposefully added lead.
2. Part mounted on FR-4 PC board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
3. Short duration pulse test used to minimize self-heating effect.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb
2O3
Fire Retardants.
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